Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/151022
Kind Code:
A1
Abstract:
This manufacturing method, in which a pair of semiconductor fins standing upright from a substrate are provided and a fixed potential line conductive material, to which source areas of the semiconductor fins are connected, is provided, in an area between the adjacent semiconductor fins, up to a location higher than any of the apex surfaces of the semiconductor fins, comprises: a first step for preparing an intermediate body in which a protective material is provided on an area outside the area between the semiconductor fins; and a second step for removing the conductive material on the protective material by etching the conductive material up to a location lower than any of the apex surfaces of the semiconductor fins, and leaving the conductive material inside the area between the semiconductor fins.
Inventors:
KIBI KAZUO (JP)
Application Number:
PCT/JP2019/001709
Publication Date:
August 08, 2019
Filing Date:
January 21, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/336; H01L21/3065; H01L21/3205; H01L21/3213; H01L21/768; H01L21/8238; H01L23/522; H01L23/532; H01L27/092; H01L29/417; H01L29/78
Domestic Patent References:
| WO2013111592A1 | 2013-08-01 | |||
| WO2017208807A1 | 2017-12-07 |
Foreign References:
| JPH0371666A | 1991-03-27 | |||
| US20170062421A1 | 2017-03-02 | |||
| US20150287795A1 | 2015-10-08 | |||
| JP2017208469A | 2017-11-24 | |||
| JP2011129771A | 2011-06-30 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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