Title:
SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/171467
Kind Code:
A1
Abstract:
A semiconductor device according to the present disclosure is provided with: a substrate having a recess; a first semiconductor element disposed in the recess; a first sealing layer disposed so as to cover a region of the substrate that includes the recess, the first sealing layer sealing the first semiconductor element; and a second semiconductor element disposed so as to cover the surface of the first sealing layer on the side opposite the substrate side. The first sealing layer is composed of a cured product of a heat-curable resin composition, and the area of the recess is less than the area of the second semiconductor element.
Inventors:
ITAGAKI KEI (JP)
OZAKI YOSHINOBU (JP)
TAZAWA TSUYOSHI (JP)
OZAKI YOSHINOBU (JP)
TAZAWA TSUYOSHI (JP)
Application Number:
PCT/JP2018/008565
Publication Date:
September 12, 2019
Filing Date:
March 06, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/56; C09J7/00; C09J201/00; H01L23/12; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| WO2014042165A1 | 2014-03-20 |
Foreign References:
| JP2015120836A | 2015-07-02 | |||
| JP2015050359A | 2015-03-16 | |||
| JP2010157631A | 2010-07-15 | |||
| JP2017168850A | 2017-09-21 | |||
| JP2007063333A | 2007-03-15 | |||
| JP2013110442A | 2013-06-06 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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