Title:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/198573
Kind Code:
A1
Abstract:
Provided are a semiconductor device and a method of manufacturing the semiconductor device which enable a hard copy of a reconstruction circuit, which employs a resistance change element, to be formed at low cost. The method of manufacturing a semiconductor device is for manufacturing a hard copy from a reconstruction circuit chip that employs a resistance-change non-volatile element formed inside a multilayer wiring layer on a semiconductor substrate, wherein the hard copy is manufactured by using a semiconductor substrate base that is the same as that of the semiconductor substrate for forming the reconstruction circuit chip.
Inventors:
TADA MUNEHIRO (JP)
Application Number:
PCT/JP2015/003082
Publication Date:
December 30, 2015
Filing Date:
June 19, 2015
Export Citation:
Assignee:
NEC CORP (JP)
International Classes:
H01L27/10; H01L21/82; H01L27/105; H01L45/00; H01L49/00
Foreign References:
| JP2000068378A | 2000-03-03 | |||
| JP2008219011A | 2008-09-18 | |||
| JP2007005580A | 2007-01-11 |
Attorney, Agent or Firm:
SHIMOSAKA, NAOKI (JP)
Naoki Shimosaka (JP)
Naoki Shimosaka (JP)
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