SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2017/094874

A1

The present invention provides a semiconductor device and a method for manufacturing a semiconductor device, in which manufacturing costs can be minimized and yield is high. With this semiconductor device, a first substrate 11 and a second substrate 12 are arranged across a gap, and first electrodes 21c and second electrodes 22c are provided at positions facing each other. A conductor film 13 has a sheet-shaped base material 23 comprising an insulator, and a plurality of connection columns 24 comprising column shaped conductors of nanosized diameters. The base material 23 is arranged so as to fill the space between the connection columns 24 arranged in parallel across a gap. The connection columns 24 are provided so that the two end parts 24a project in respective fashion from the two surfaces of the base material 23. The conductive film 13 is arranged between the first substrate 11 and the second substrate 12, and the two end parts 24a of the connection columns 24 are joined in a respective manner to the first electrode 21c and the second electrode 22c so as to electrically connect the first electrode 21c and the second electrode 22c.

JPH0697218	SEMICONDUCTOR DEVICE
JP2014225602	MOUNTING DEVICE AND MOUNTING METHOD OF ELECTRONIC COMPONENT

KOYANAGI MITSUMASA (JP)
TANAKA TETSU (JP)
FUKUSHIMA TAKAFUMI (JP)
LEE KANGWOOK (JP)
ABE HIROFUMI (JP)
HOTTA YOSHINORI (JP)

PCT/JP2016/085865

June 08, 2017

December 02, 2016

Click for automatic bibliography generation  

UNIV TOHOKU (JP)
FUJIFILM CORP (JP)

H01L21/60; B23K20/00; H01L25/065; H01L25/07; H01L25/18; H01R11/01; H05K1/14

JP2009164095A	2009-07-23
JP2002151549A	2002-05-24
JP2000286293A	2000-10-13
JPS62237739A	1987-10-17

WATANABE Mochitoshi et al. (JP)

View/Download PDF      PDF Help

Previous Patent: WIPING TIP

Next Patent: INTERNAL-COMBUSTION ENGINE AND CONTROL METHOD FOR SAME