Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/146965
Kind Code:
A1
Abstract:
[Problem] The present invention addresses the problem of providing a semiconductor device wherein a terminal for outputting electrical signals to the outside is further miniaturized, and a method for manufacturing the semiconductor device.
[Solution] This semiconductor device is provided with: a first chip, which is formed by laminating a first substrate and a first wiring layer, and which includes a sensor element; a second chip, which is formed by laminating a second substrate and a second wiring layer, and which is bonded to the first chip such that the first wiring layer and the second wiring layer face each other; and at least one through hole via, which is electrically connected to the second wiring layer, and which protrudes from a second chip surface by penetrating the second substrate, said second chip surface being on the reverse side of the surface to which the first chip is laminated.
Inventors:
AMANO SHIGEKI (JP)
Application Number:
PCT/JP2017/046637
Publication Date:
August 16, 2018
Filing Date:
December 26, 2017
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H01L21/3205; H01L21/768; H01L21/8234; H01L23/522; H01L27/00; H01L27/088
Domestic Patent References:
| WO2016185901A1 | 2016-11-24 |
Foreign References:
| JP2014072294A | 2014-04-21 | |||
| JP2008130603A | 2008-06-05 |
Attorney, Agent or Firm:
KAMEYA, Yoshiaki et al. (JP)
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