Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/146984
Kind Code:
A1
Abstract:
A semiconductor device according to one embodiment of this disclosure is provided with: a first substrate having an active element formed therein; and a second substrate that is stacked with the first substrate and that is electrically connected to the first substrate, wherein the second substrate has a first transistor constituting a logic circuit formed on a first surface thereof and has a nonvolatile memory element formed on a second surface thereof, which is a surface on the reverse side of the first surface.

More Like This:
Inventors:
YOKOYAMA TAKASHI (JP)
UMEBAYASHI TAKU (JP)
FUJII NOBUTOSHI (JP)
Application Number:
PCT/JP2018/000408
Publication Date:
August 16, 2018
Filing Date:
January 11, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/8239; H01L27/105; H01L27/146; H01L29/82; H01L43/08
Domestic Patent References:
WO2006129762A12006-12-07
WO2016009942A12016-01-21
Foreign References:
JP2015065407A2015-04-09
JP2015046477A2015-03-12
JP2015082564A2015-04-27
JP2004356537A2004-12-16
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
Download PDF: