Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/039173
Kind Code:
A1
Abstract:
The present invention simplifies manufacture of an alignment mark of a semiconductor device. Provided is a semiconductor device that is provided with a semiconductor substrate, an epitaxial layer, and an alignment mark. The epitaxial layer that is provided in the semiconductor device is formed of a single crystal semiconductor epitaxially grown on a surface of the semiconductor substrate that is provided in the semiconductor device. The alignment mark that is provided in the semiconductor device is disposed between the semiconductor substrate and the epitaxial layer.
Inventors:
SATO TERUYUKI (JP)
ARAKAWA SHINICHI (JP)
ENOMOTO TAKAYUKI (JP)
CHIBA YOHEI (JP)
ARAKAWA SHINICHI (JP)
ENOMOTO TAKAYUKI (JP)
CHIBA YOHEI (JP)
Application Number:
PCT/JP2018/027747
Publication Date:
February 28, 2019
Filing Date:
July 24, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G03F9/00; G03F7/20
Foreign References:
| JP2002033458A | 2002-01-31 | |||
| JP2012009576A | 2012-01-12 | |||
| JPH11329923A | 1999-11-30 | |||
| JPH021901A | 1990-01-08 | |||
| JP2010021293A | 2010-01-28 | |||
| JP2011165987A | 2011-08-25 | |||
| JP2010135533A | 2010-06-17 | |||
| JP2007280978A | 2007-10-25 |
Attorney, Agent or Firm:
MATSUO Kenichiro (JP)
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