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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/130700
Kind Code:
A1
Abstract:
This semiconductor device is provided with: a flexible resin substrate having an adhesive layer on one surface; a semiconductor element that is provided in a face-down manner on the one surface of the resin substrate via the adhesive layer; a first connection member having an island adhered to the semiconductor element surface on the reverse side of the resin substrate, and a first lead, which is integrally formed with the island, and which extends in one direction parallel to the one surface of the resin substrate; a second connection member having a conductive section, which is provided on the one surface of the resin substrate by being adjacent to the semiconductor element, and which is adhered to the resin substrate, and a second lead, which is integrally formed with the conductive section, and which extends in another direction different from the one direction; a first via formed by introducing a conductive material into a first contact hole that is provided in the resin substrate so that a surface electrode of the semiconductor element is exposed; a second via formed by introducing a conductive material into a second contact hole that is provided in the resin substrate so that the conductive section is exposed; and a common electrode, which is provided on the other surface of the resin substrate, and which connects the first via and the second via to each other.

Inventors:
KUROSAWA MASARU (JP)
KAWANO MICHIHARU (JP)
HAGIWARA YASUHITO (JP)
HAMAMOTO TAKAKI (JP)
Application Number:
JP2018/036269
Publication Date:
July 04, 2019
Filing Date:
September 28, 2018
Export Citation:
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Assignee:
TAIYO YUDEN KK (JP)
International Classes:
H01L21/60; H01L23/48
Foreign References:
JP2008078561A2008-04-03
JP2013004943A2013-01-07
JP2010056291A2010-03-11
Attorney, Agent or Firm:
ISSHIKI & CO. (JP)
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