Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/149188
Kind Code:
A1
Abstract:
A semiconductor device 100 is provided with a substrate 12 and a cover 40. The substrate 12 has a pattern 6a formed thereon. The cover 40 is bonded to the pattern 6a by means of a bonding material 5. The cover 40 includes a distal end portion 40e bonded to the pattern 6a by means of the bonding material 5. The distal end portion 40e includes a distal end 40es in contact with the pattern 6a. The distal end portion 40e is configured such that regions of the distal end portion 40e closer to the distal end 40es have smaller cross-sectional areas.
Inventors:
TANISHITA TOMOHIRO (JP)
Application Number:
PCT/JP2020/000276
Publication Date:
July 23, 2020
Filing Date:
January 08, 2020
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/02; H01L23/06
Domestic Patent References:
| WO2016199634A1 | 2016-12-15 |
Foreign References:
| JPH04212439A | 1992-08-04 | |||
| JPH059026U | 1993-02-05 | |||
| JPH0590429A | 1993-04-09 | |||
| JP2006093232A | 2006-04-06 | |||
| JPH10242315A | 1998-09-11 | |||
| JP2014150333A | 2014-08-21 | |||
| JPH02130120U | 1990-10-26 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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