Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/176996
Kind Code:
A1
Abstract:
A semiconductor device comprises a semiconductor element, a first electroconductive member, a second electroconductive member, a connection member, and a metal plate. The semiconductor element has an element main surface and an element back surface that are separated in the thickness direction. A main-surface electrode is positioned on the element main surface. The first electroconductive member faces the element back surface, the semiconductor element being joined to the first electroconductive member. The first electroconductive member and the second electroconductive member are positioned separated from each other. The connection member causes the main-surface electrode and the second electroconductive member to be electrically conductive with each other. The metal plate is interposed between the main-surface electrode and the connection member in the thickness direction. The main-surface electrode and the metal plate are joined to each other by solid-phase diffusion.
Inventors:
YOSHIHARA KATSUHIKO (JP)
WU XIAOPENG (JP)
WU XIAOPENG (JP)
Application Number:
PCT/JP2021/005271
Publication Date:
September 10, 2021
Filing Date:
February 12, 2021
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L21/60
Domestic Patent References:
| WO2016143557A1 | 2016-09-15 |
Foreign References:
| JP2013179229A | 2013-09-09 | |||
| JP2019114575A | 2019-07-11 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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