Title:
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2019/073801
Kind Code:
A1
Abstract:
This art relates to: a semiconductor device such that it is possible to improve the reliability of a glass substrate on which a wiring layer is formed, is able to be improved; and a method for producing this semiconductor device. The semiconductor device is provided with: a glass substrate having one or more wiring layers comprising wiring formed on the front surface or on the front and back surfaces thereof; an electronic component which is disposed within a glass opening formed in the glass substrate; and a rewiring line which connects the wiring line of the glass substrate and the electronic component to each other. The present technology is applicable, for example, to a high frequency front end module and the like.
Inventors:
MITARAI SHUN (JP)
YANAGAWA SHUSAKU (JP)
YANAGAWA SHUSAKU (JP)
Application Number:
PCT/JP2018/035840
Publication Date:
April 18, 2019
Filing Date:
September 27, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L23/15; H01L23/12; H01L25/065; H01L25/07; H01L25/18; H05K3/46
Domestic Patent References:
| WO2013047520A1 | 2013-04-04 |
Foreign References:
| JP2016213466A | 2016-12-15 | |||
| US20170263522A1 | 2017-09-14 | |||
| JP2011216635A | 2011-10-27 | |||
| JP2016076510A | 2016-05-12 | |||
| JP2007123524A | 2007-05-17 | |||
| JP2015050457A | 2015-03-16 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
Download PDF:
Previous Patent: CONTROL DEVICE FOR ROTARY ELECTRIC MACHINE
Next Patent: SENDING DEVICE, SENDING METHOD, AND PROGRAM
Next Patent: SENDING DEVICE, SENDING METHOD, AND PROGRAM