Title:
SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SAME, THERMOSETTING RESIN COMPOSITION, BONDING FILM AND INTEGRATED DICING/DIE BONDING FILM
Document Type and Number:
WIPO Patent Application WO/2022/163465
Kind Code:
A1
Abstract:
A thermosetting resin composition which is used for the production of a chip embedded semiconductor device, and which contains a curing agent that has a hydroxyl equivalent of 150 g/eq or less, while having a melt viscosity of 1,000 to 11,500 Pa·s at 120°C.
Inventors:
HASHIMOTO HIROKI (JP)
YAMAMOTO KAZUHIRO (JP)
KUNITO YUI (JP)
YAMAMOTO KAZUHIRO (JP)
KUNITO YUI (JP)
Application Number:
PCT/JP2022/001802
Publication Date:
August 04, 2022
Filing Date:
January 19, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L25/065; C09J5/00; C09J7/30; C09J11/04; C09J11/06; C09J201/00; H01L21/52; H01L25/07; H01L25/18
Domestic Patent References:
| WO2019220540A1 | 2019-11-21 | |||
| WO2020157805A1 | 2020-08-06 | |||
| WO2020013250A1 | 2020-01-16 |
Foreign References:
| JP2015122422A | 2015-07-02 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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