Title:
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/188831
Kind Code:
A1
Abstract:
[Problem] To suppress the alignment precision required in the arrangement of a shield. [Solution] A semiconductor device comprising a first substrate and a second substrate. The first substrate comprises: a plurality of first wirings insulated from each other; a plurality of first electrodes insulated from each other and respectively connected to the first wirings; and a first shield electrode arranged between at least the plurality of first electrodes and insulated from the first electrodes. The second substrate comprises: a plurality of second wirings insulated from each other; a plurality of second electrodes insulated from each other and respectively connected to the second wirings; and a second shield electrode arranged between at least the plurality of second electrodes and insulated from the second electrodes. The first electrodes and the second electrodes are electrically connected by a hybrid junction. The first shield electrode and the second shield electrode are electrically connected by a hybrid junction and form a first shield.
Inventors:
FUJII NOBUTOSHI (JP)
SAITO SUGURU (JP)
KANEGUCHI TOKIHISA (JP)
SHIOYAMA TADAMASA (JP)
SAITO SUGURU (JP)
KANEGUCHI TOKIHISA (JP)
SHIOYAMA TADAMASA (JP)
Application Number:
PCT/JP2023/003848
Publication Date:
October 05, 2023
Filing Date:
February 06, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/3205; H01L21/768; H01L23/522; H01L23/532; H01L27/146
Foreign References:
| JP2012256736A | 2012-12-27 | |||
| JP2020088380A | 2020-06-04 | |||
| JP2013038112A | 2013-02-21 |
Attorney, Agent or Firm:
MIYAJIMA Manabu (JP)
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