Title:
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2000/055910
Kind Code:
A1
Abstract:
The invention provides a small semiconductor device including a semiconductor element with external terminals, and a semiconductor module including such a small semiconductor device, which protect their external terminals from damage due to changes in temperature when they are on a printed-circuit board. Projections are formed on lands for connection of external terminals of the semiconductor device, and the external terminals are connected with the ends of the corresponding projections. Protective plastic film is formed between the semiconductor element and lands.
More Like This:
| JP4090410 | Semiconductor device |
| JPH0344050 | SEMICONDUCTOR DEVICE AND ITS MANUFACTURE |
Inventors:
YAGUCHI AKIHIRO (JP)
MIURA HIDEO (JP)
KAZAMA ATSUSHI (JP)
NISHIMURA ASAO (JP)
MIURA HIDEO (JP)
KAZAMA ATSUSHI (JP)
NISHIMURA ASAO (JP)
Application Number:
PCT/JP2000/001550
Publication Date:
September 21, 2000
Filing Date:
March 14, 2000
Export Citation:
Assignee:
HITACHI LTD (JP)
YAGUCHI AKIHIRO (JP)
MIURA HIDEO (JP)
KAZAMA ATSUSHI (JP)
NISHIMURA ASAO (JP)
YAGUCHI AKIHIRO (JP)
MIURA HIDEO (JP)
KAZAMA ATSUSHI (JP)
NISHIMURA ASAO (JP)
International Classes:
H01L21/60; H01L23/12; H01L23/31; H01L23/485; (IPC1-7): H01L23/12
Domestic Patent References:
| WO1998032170A1 | 1998-07-23 |
Foreign References:
| JP2000068671A | 2000-03-03 | |||
| JPH08330313A | 1996-12-13 | |||
| JPH1154649A | 1999-02-26 | |||
| JPH10289966A | 1998-10-27 | |||
| EP0706208A2 | 1996-04-10 | |||
| JPH1012768A | 1998-01-16 | |||
| JPH10214911A | 1998-08-11 |
Attorney, Agent or Firm:
Asamura, Kiyoshi (New Ohtemachi Bldg. 2-1 Ohtemachi 2-chome Chiyoda-ku, Tokyo, JP)
Download PDF: