Title:
SEMICONDUCTOR DEVICE MODULE
Document Type and Number:
WIPO Patent Application WO/2017/208430
Kind Code:
A1
Abstract:
The present invention relates to a semiconductor device module, and is provided with: a semiconductor device having an upper surface electrode and a lower surface electrode; a substrate, to which the lower surface electrode of the semiconductor device is bonded; a heat sink having the substrate mounted thereon; a lead electrode, in which a main current of the semiconductor device flows; an insulating case that is disposed to surround the substrate; and a holding body, which is provided in a cantilever manner in the insulating case, and which holds the lead electrode. One end of the lead electrode is brazed to the upper surface electrode of the semiconductor device, and the other end side is inserted into the wall surface of the insulating case, and the holding body is engaged on the one end of the lead electrode so as to regulate moving of the lead electrode.
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Inventors:
IIZUKA ARATA (JP)
OKAMOTO KOREHIDE (JP)
TSUJI NATSUKI (JP)
OKAMOTO KOREHIDE (JP)
TSUJI NATSUKI (JP)
Application Number:
PCT/JP2016/066538
Publication Date:
December 07, 2017
Filing Date:
June 03, 2016
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L25/07; H01L23/28; H01L23/48; H01L25/18
Foreign References:
| JP2015133462A | 2015-07-23 | |||
| JP2002076259A | 2002-03-15 | |||
| JP2016072575A | 2016-05-09 | |||
| JP2013098450A | 2013-05-20 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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