Title:
SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MOUNTING BODY
Document Type and Number:
WIPO Patent Application WO/2023/112723
Kind Code:
A1
Abstract:
In the present invention, a semiconductor device comprises a semiconductor element and a first terminal that is conductive with the semiconductor element. The first terminal has a first part in which at least one portion extends in a first direction, and a second part extending in the first direction. Viewed in a second direction orthogonal to the first direction, the second part overlaps the first part. The first terminal may also have a third part that links the first part and the second part. Viewed in the first direction, the third part may also bulge from the first part and the second part. The second part may also be positioned away from the first part.
Inventors:
HAYASHIGUCHI MASASHI (JP)
ABE HIDETOSHI (JP)
ABE HIDETOSHI (JP)
Application Number:
PCT/JP2022/044545
Publication Date:
June 22, 2023
Filing Date:
December 02, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/48; H01L23/36; H01L25/07; H01L25/18
Domestic Patent References:
| WO2021131611A1 | 2021-07-01 |
Foreign References:
| JP2000208896A | 2000-07-28 | |||
| US20160365296A1 | 2016-12-15 | |||
| JPS327516Y1 | 1957-07-19 | |||
| JPS58116221U | 1983-08-08 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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