Title:
SEMICONDUCTOR DEVICE, AND MOUNTING STRUCTURE FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/176783
Kind Code:
A1
Abstract:
A semiconductor device comprises a lead, a first semiconductor element, and a sealing resin that covers at least a part of the lead and the first semiconductor element. The lead has a main surface on which the first semiconductor element is mounted, and a reverse surface on the opposite side from the main surface. Also, the lead includes a first part having a first surface positioned between the main surface and the reverse surface in a z-direction in which the main surface and the reverse surface are separated. The first surface of the lead is covered by the sealing resin, and is configured by a plurality of convex regions and a plurality of concave regions being alternately disposed as viewed from the z-direction.
Inventors:
FURUTANI RYUICHI (JP)
Application Number:
PCT/JP2019/009388
Publication Date:
September 19, 2019
Filing Date:
March 08, 2019
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/50; H01L23/28; H01L25/07; H01L25/18
Foreign References:
| JP2014207430A | 2014-10-30 | |||
| JP2003332512A | 2003-11-21 | |||
| JPS5988857A | 1984-05-22 | |||
| JP2013145825A | 2013-07-25 | |||
| JP2010171104A | 2010-08-05 |
Attorney, Agent or Firm:
YOSHIDA Minoru et al. (JP)
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