Title:
SEMICONDUCTOR DEVICE, PACKAGE DEVICE, LIGHT-EMITTING PANEL APPARATUS, WAFER AND METHOD OF PRODUCING A SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/194095
Kind Code:
A1
Abstract:
There is provided a semiconductor device (101), including: a first semiconductor layer (25) having a main surface that is a growth surface in a lamination direction and a first side surface (251) disposed at a first angle; and a second semiconductor layer (24) adjacent the first semiconductor layer (25) having a second side surface (241) extending from the first side surface (251) of the first semiconductor layer (25) at a second angle different from the first angle.
Inventors:
OKUYAMA HIROYUKI (JP)
Application Number:
PCT/JP2015/002561
Publication Date:
December 23, 2015
Filing Date:
May 21, 2015
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H01L33/20; H01L33/22; H01L33/30
Foreign References:
| US20100265981A1 | 2010-10-21 | |||
| US20120171791A1 | 2012-07-05 | |||
| JPS62281387A | 1987-12-07 | |||
| US20130146928A1 | 2013-06-13 | |||
| EP1798781A2 | 2007-06-20 | |||
| EP2495761A2 | 2012-09-05 | |||
| US20140138729A1 | 2014-05-22 | |||
| JP2012182276A | 2012-09-20 | |||
| JP2011233733A | 2011-11-17 |
Attorney, Agent or Firm:
OMORI, Junichi (7-5-47 Akasaka Minato-k, Tokyo 52, JP)
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