Title:
SEMICONDUCTOR DEVICE PACKAGE AND LIGHT SOURCE DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/027192
Kind Code:
A1
Abstract:
A semiconductor device package provided in an embodiment comprises: a first and a second frame disposed to be spaced apart from each other; a body disposed between the first and the second frame; and a semiconductor devicedisposed on the first and the second frame and comprising a semiconductor layer and a first and a second electrode arranged on the semiconductor layer, wherein the first and the second frame comprise a first metal layer having multiple pores, and the first metal layer of the first and the second frame may comprise coupling parts in areas where the first metal layer overlaps the first and the second electrode, respectively.
Inventors:
KIM KI SEOK (KR)
PARK HEE JEONG (KR)
SONG JUNE O (KR)
LIM CHANG MAN (KR)
PARK HEE JEONG (KR)
SONG JUNE O (KR)
LIM CHANG MAN (KR)
Application Number:
PCT/KR2018/008583
Publication Date:
February 07, 2019
Filing Date:
July 27, 2018
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H01L33/48; H01L33/10; H01L33/20; H01L33/40
Domestic Patent References:
| WO2015066730A1 | 2015-05-07 |
Foreign References:
| KR20080081331A | 2008-09-09 | |||
| KR20160137476A | 2016-11-30 | |||
| JP2016072525A | 2016-05-09 | |||
| JP2007507895A | 2007-03-29 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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