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Title:
SEMICONDUCTOR DEVICE PACKAGE
Document Type and Number:
WIPO Patent Application WO/2014/098324
Kind Code:
A1
Abstract:
The present invention relates to a semiconductor device package having a fan-out structure in which input/output terminals are arranged in the vicinity of at least one first semiconductor chip and electrically connected to the at least one first semiconductor chip, and may comprise a second semiconductor chip spaced apart from the input/output terminals and arranged to face the at least one first semiconductor chip. The semiconductor device package may ensure improved degree of integration, and may improve connection stability between the input/output terminals and wires to thus achieve improved reliability of the semiconductor device package.

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Inventors:
JEONG JIN-WOOK (KR)
Application Number:
PCT/KR2013/003182
Publication Date:
June 26, 2014
Filing Date:
April 16, 2013
Export Citation:
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Assignee:
HANA MICRON INC (KR)
International Classes:
H01L23/48; H01L23/12
Foreign References:
KR101185457B12012-10-02
KR20090088271A2009-08-19
KR101056748B12011-08-16
KR20110133769A2011-12-14
KR20120126365A2012-11-21
Attorney, Agent or Firm:
PARK, YOUNG-WOO (KR)
박영우 (KR)
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