Title:
SEMICONDUCTOR DEVICE AND PIEZOELECTRIC OSCILLATOR
Document Type and Number:
WIPO Patent Application WO/2019/013028
Kind Code:
A1
Abstract:
This semiconductor device (100) is provided with a first substrate (110) having a principal surface (110A), a semiconductor chip (103), and a second substrate (120) which is stacked on the principal surface (110A) of the first substrate (110), and which, when viewing the principal surface (110A) of the first substrate (110) from the normal direction, has a mounting region (121) where the semiconductor chip (103) is mounted and a peripheral region (122) located outside of the mounting region (121). The rigidity of the inside portion (123) of the peripheral region (122) connected to the mounting region (121) is less than the rigidity of the outside portion (124) of the peripheral region (122), and in this way, the second substrate (120) is supported on the first substrate (110) in a manner allowing displacement of the mounting region (121) relative to the first substrate (110).
Inventors:
YAJIMA ARITSUGU (JP)
Application Number:
PCT/JP2018/025046
Publication Date:
January 17, 2019
Filing Date:
July 02, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/02; H01L21/60; H01L23/08; H01L23/12; H01L23/13; H01L23/32; H01L23/58; H03B5/32
Foreign References:
| JP2012109331A | 2012-06-07 | |||
| JP2000082868A | 2000-03-21 | |||
| JP2005235997A | 2005-09-02 | |||
| JP2005322844A | 2005-11-17 | |||
| JPH07193091A | 1995-07-28 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Download PDF: