Title:
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2018/235197
Kind Code:
A1
Abstract:
This semiconductor device comprises: a substrate; a lead frame having a first surface and a second surface on the surface facing away from the first surface, the second surface being joined to the upper surface of the substrate; a semiconductor element provided on the first surface of the lead frame; and a molded resin covering the upper surface of the substrate, the lead frame, and the semiconductor element. Provided in the molded resin are terminal insertion holes, each extending from the surface of the molded resin to the lead frame, for inserting a press-fit terminal therein. Provided in the lead frame are opening sections, each communicating with the corresponding terminal insertion hole, for press-fitting the corresponding press-fit terminal therein.
Inventors:
ICHIKAWA KEITARO (JP)
Application Number:
PCT/JP2017/022870
Publication Date:
December 27, 2018
Filing Date:
June 21, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/50; H01L23/28; H01L23/48; H01L25/07; H01L25/18
Foreign References:
| JPH01196153A | 1989-08-07 | |||
| JPH0945821A | 1997-02-14 | |||
| JP2013152966A | 2013-08-08 | |||
| US5184285A | 1993-02-02 | |||
| JP2016103941A | 2016-06-02 | |||
| JP2014146845A | 2014-08-14 |
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
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