Title:
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/112997
Kind Code:
A1
Abstract:
A semiconductor device according to the present invention is provided with: a plurality of electrical circuit bodies, each of which has a semiconductor element; a pair of heat dissipation members, between which the plurality of electrical circuit bodies are sandwiched from both surface sides; a first heat transfer member which is arranged between one of the heat dissipation members and one surface of each of the plurality of electrical circuit bodies; and a second heat transfer member which is arranged between the other one of the heat dissipation members and the other surface of each of the plurality of electrical circuit bodies. With respect to this semiconductor device, the elongation of the first heat transfer member at the time of separation is higher than the elongation of the second heat transfer member at the time of separation.
Inventors:
TANG NING (JP)
TSUYUNO NOBUTAKE (JP)
KANEKO YUJIRO (JP)
TSUYUNO NOBUTAKE (JP)
KANEKO YUJIRO (JP)
Application Number:
PCT/JP2022/046286
Publication Date:
June 22, 2023
Filing Date:
December 15, 2022
Export Citation:
Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
H01L23/36; H01L25/07; H01L25/18; H02M7/48
Foreign References:
| JP2021141275A | 2021-09-16 | |||
| JP2021048255A | 2021-03-25 | |||
| JP2016092266A | 2016-05-23 | |||
| JP2012033872A | 2012-02-16 | |||
| JP2017017229A | 2017-01-19 |
Attorney, Agent or Firm:
SUNNEXT INTERNATIONAL PATENT OFFICE (JP)
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