Title:
SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCTION THEREOF
Document Type and Number:
WIPO Patent Application WO/2011/145159
Kind Code:
A1
Abstract:
A first semiconductor substrate (101) and a second semiconductor substrate (111) are bound to each other through an adhesive agent (107A). The first semiconductor substrate (101) is equipped with a first electrode (104) of which at least an end part is exposed, and the second semiconductor substrate (111) is equipped with a second electrode (114) of which at least an end part is exposed. The adhesive agent (107A) contains carbon nanotubes and is applied onto an area excluding a connection part between the first electrode (104) and the second electrode (114) and an area adjacent to the connection part.
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Inventors:
AOI NOBUO
Application Number:
PCT/JP2010/007010
Publication Date:
November 24, 2011
Filing Date:
December 01, 2010
Export Citation:
Assignee:
PANASONIC CORP (JP)
AOI NOBUO
AOI NOBUO
International Classes:
H01L25/065; H01L21/3205; H01L23/373; H01L23/52; H01L25/07; H01L25/18; H01L27/00
Foreign References:
| JP2009246258A | 2009-10-22 | |||
| JP2009164152A | 2009-07-23 |
Attorney, Agent or Firm:
MAEDA, Hiroshi et al. (JP)
Hiroshi Maeda (JP)
Hiroshi Maeda (JP)
Download PDF:
Claims:
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