Title:
SEMICONDUCTOR DEVICE PRODUCING DEVICE, AND SEMICONDUCTOR DEVICE PRODUCING METHOD
Document Type and Number:
WIPO Patent Application WO/2004/081997
Kind Code:
A1
Abstract:
A semiconductor device producing device (1) comprises a joining means (24), which executes the step of joining electrode portions together which are formed in a chip or chip assembly, for joining electrode portions formed in the chip or each chip included in the chip assembly, a transfer means disposed between the joining means (24) and executing means for executing each of the other steps and adapted to transfer the chip or chip assembly, and a control means (PC) for determining the steps for laminating the chip or chip assembly including a step using the joining means (24), according to the chip or chip assembly. And the control means (PC) obtains information about the chip or chip assembly and transmits the information corresponding to the determined step to the transfer means and to the executing means.
Inventors:
OKAMOTO KAZUYA (JP)
Application Number:
PCT/JP2004/003332
Publication Date:
September 23, 2004
Filing Date:
March 12, 2004
Export Citation:
Assignee:
NIPPON KOGAKU KK (JP)
OKAMOTO KAZUYA (JP)
ICHIKAWA MASARU (JP)
OKAMOTO KAZUYA (JP)
ICHIKAWA MASARU (JP)
International Classes:
H01L21/00; (IPC1-7): H01L21/02; H01L25/18; H01L27/00
Foreign References:
| JPH06140459A | 1994-05-20 | |||
| JP2001210783A | 2001-08-03 | |||
| JPH10256109A | 1998-09-25 | |||
| JPH11265841A | 1999-09-28 | |||
| JP2000228489A | 2000-08-15 |
Attorney, Agent or Firm:
Nagai, Fuyuki (2-1-1 Uchisaiwai-cho, Chiyoda-k, Tokyo 11, JP)
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