Title:
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PRODUCING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/033768
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a semiconductor device in which preferable sealing resins can be used for sealing lead frames and for sealing light receiving-emitting areas, respectively, and which can be produced easily with inexpensive facilities.
The present invention is characterized in including: a light receiving element (12) having a light receiving area (21); a lead frame (11) that has the light receiving element (12) installed on a top surface thereof and has a back surface thereof as a solder surface; a first sealing resin (13) that is made of a potting resin material and is filled in at least frame interstices (35) of the lead frame (11) in such a manner that the light receiving area (21) is exposed; and a second sealing resin (14) that is made of a potting resin material different from that of the first sealing resin (13), and is formed by potting so as to seal at least the light receiving area (21).
Inventors:
ASAMI TOMOYUKI (JP)
NITTOH SHUICHI (JP)
NITTOH SHUICHI (JP)
Application Number:
PCT/JP2012/005347
Publication Date:
March 06, 2014
Filing Date:
August 27, 2012
Export Citation:
Assignee:
PIONEER CORP (JP)
PIONEER MICRO TECHNOLOGY CORP (JP)
ASAMI TOMOYUKI (JP)
NITTOH SHUICHI (JP)
PIONEER MICRO TECHNOLOGY CORP (JP)
ASAMI TOMOYUKI (JP)
NITTOH SHUICHI (JP)
International Classes:
H01L31/02; H01L23/29; H01L23/31
Foreign References:
| JP2010028009A | 2010-02-04 | |||
| JPH07283441A | 1995-10-27 | |||
| JP2009016664A | 2009-01-22 | |||
| JP2008041917A | 2008-02-21 |
Attorney, Agent or Firm:
OCHIAI, MINORU (JP)
Ochiai 稔 (JP)
Ochiai 稔 (JP)
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