Title:
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE PRODUCTION METHOD AND ELECTRONIC MACHINE
Document Type and Number:
WIPO Patent Application WO/2019/073719
Kind Code:
A1
Abstract:
[Problem] To reduce production costs while further ensuring that a drop in characteristics caused by signals (distortion) other than input/output waves is suppressed. [Solution] This semiconductor device comprises: a circuit base board having an insulation film layer positioned above a predetermined semiconductor substrate, and a semiconductor layer positioned above the insulation film layer; a plurality of passive elements provided on the circuit base board and connected electrically to one another; and an electromagnetic shield layer provided locally within the insulation film layer to correspond to the site where at least any of the passive elements, among the plurality of passive elements, is provided. The electromagnetic shield layer and the semiconductor substrate are separated electrically from one another.
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Inventors:
SAKA NAOKI (JP)
Application Number:
PCT/JP2018/032715
Publication Date:
April 18, 2019
Filing Date:
September 04, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/822; H01L21/02; H01L21/265; H01L21/3205; H01L21/336; H01L21/762; H01L21/768; H01L23/522; H01L27/04; H01L27/12; H01L29/786
Foreign References:
| JP2000058844A | 2000-02-25 | |||
| JP2014509087A | 2014-04-10 | |||
| US9755029B1 | 2017-09-05 |
Attorney, Agent or Firm:
KAMEYA, Yoshiaki et al. (JP)
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