Title:
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2011/030867
Kind Code:
A1
Abstract:
Disclosed is a semiconductor device that comprises a semiconductor chip; a lead that is disposed to the side of the semiconductor chip; and a wire that has both one end and the other end thereof connected to the semiconductor chip and the lead, and that is provided with a ball part and a stitch part, which has a wedged shape when viewed from the side, upon both the semiconductor chip and the lead. The angle of entry of the wire to the lead is at least 50°, and the length of the stitch part is at least 33 μm.
Inventors:
YASUNAGA SHOUJI (JP)
Application Number:
PCT/JP2010/065652
Publication Date:
March 17, 2011
Filing Date:
September 10, 2010
Export Citation:
Assignee:
ROHM CO LTD (JP)
YASUNAGA SHOUJI (JP)
YASUNAGA SHOUJI (JP)
International Classes:
H01L21/60; H01L21/52
Foreign References:
| JP2008041999A | 2008-02-21 | |||
| JP2004319830A | 2004-11-11 | |||
| JPH07106350A | 1995-04-21 |
Attorney, Agent or Firm:
INAOKA, Kosaku et al. (JP)
Kosaku Inaoka (JP)
Kosaku Inaoka (JP)
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