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Title:
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2013/125684
Kind Code:
A1
Abstract:
Provided is a production method for a semiconductor device in which the respective connecting sections of a semiconductor chip and a wiring circuit board are electrically connected to each other, or for a semiconductor device in which the respective connecting sections of a plurality of semiconductor chips are electrically connected to each other. The production method for a semiconductor comprises a step in which at least one portion of the connecting section is sealed using an adhesive for semiconductors that contains a compound comprising the group represented by formula (1). [In formula (1), R1 indicates an electron-donating group.]

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Inventors:
HONDA KAZUTAKA (JP)
NAGAI AKIRA (JP)
SATOU MAKOTO (JP)
Application Number:
PCT/JP2013/054538
Publication Date:
August 29, 2013
Filing Date:
February 22, 2013
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/60; B23K35/363; C08L63/00; C09J11/06; C09J201/00; H01L23/29; H01L23/31
Foreign References:
JP2011178840A2011-09-15
JP2011016967A2011-01-27
JP2002239785A2002-08-28
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
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