Title:
SEMICONDUCTOR DEVICE AND SOLID-STATE IMAGE SENSOR
Document Type and Number:
WIPO Patent Application WO/2020/194981
Kind Code:
A1
Abstract:
This semiconductor device (50) comprises a first substrate (20) which is singulated and includes a first semiconductor circuit (LOG) that has a first terminal (25), and a second substrate (10) which includes a second semiconductor circuit (PIX) that has a second terminal (16), wherein the first terminal (25) and the second terminal (16) are connected. The second substrate (10) includes a first insulating layer (13) which is disposed in the upper part of the second substrate (10), and a second insulating layer (14) that is disposed above at least a portion of the first insulating layer (13) and has the second terminal (16) disposed therein.
Inventors:
NITTA YOSUKE (JP)
Application Number:
PCT/JP2020/000118
Publication Date:
October 01, 2020
Filing Date:
January 07, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/3205; H01L21/768; H01L23/522; H01L27/146
Domestic Patent References:
| WO2012161044A1 | 2012-11-29 |
Foreign References:
| JP2010245506A | 2010-10-28 | |||
| JP2016171297A | 2016-09-23 | |||
| JP2014027359A | 2014-02-06 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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