Title:
SEMICONDUCTOR DEVICE AND SOLID-STATE IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/021873
Kind Code:
A1
Abstract:
The present invention efficiently achieves electrical conduction between semiconductor substrates in cases where a plurality of semiconductor substrates are laminated. A semiconductor device according to the present invention is provided with a plurality of semiconductor substrates (110, 120) and a connection substrate (210). The plurality of semiconductor substrates are laminated one upon another and bonded with each other. The connection substrate is provided on lateral surfaces of the plurality of semiconductor substrates, said lateral surfaces being different from bonding surfaces. The connection substrate electrically connects the wiring lines of the plurality of semiconductor substrates to each other. Consequently, the plurality of semiconductor substrates are electrically connected to each other without being provided with connection terminals on the bonding surfaces.
Inventors:
SHOHJI REIJIROH (JP)
Application Number:
PCT/JP2018/026596
Publication Date:
January 31, 2019
Filing Date:
July 13, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L25/065; H01L21/3205; H01L21/768; H01L23/52; H01L23/522; H01L25/07; H01L25/18; H01L27/146
Foreign References:
| US5714802A | 1998-02-03 | |||
| JPH05268535A | 1993-10-15 | |||
| JP2012054450A | 2012-03-15 |
Attorney, Agent or Firm:
MARUSHIMA, Toshikazu (JP)
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