Title:
SEMICONDUCTOR DEVICE TEST SOCKET
Document Type and Number:
WIPO Patent Application WO/2017/183788
Kind Code:
A1
Abstract:
An embodiment of the present invention provides a test socket for a semiconductor device, comprising: a base layer having a first surface and a second surface opposite to the first surface, and having, on the second surface, an external connection pad formed at a pitch corresponding to an electrode terminal of a test board; a plurality of circuit patterns formed to be partially exposed on the surface of the base layer and rearranged at a pitch corresponding to the external connection pad; a plurality of electrode patterns formed on the first surface to be electrically connected to the circuit patterns and an external connection terminal of a semiconductor device, and arranged at a pitch corresponding to the external connection terminal; and an elastic layer covering the electrode patterns such that the electrode patterns are partially exposed.
Inventors:
CHO YONG HO (KR)
PARK SANG HEE (KR)
PARK SANG HEE (KR)
Application Number:
PCT/KR2016/013983
Publication Date:
October 26, 2017
Filing Date:
November 30, 2016
Export Citation:
Assignee:
MICRO FRIEND CO LTD (KR)
International Classes:
G01R1/04; G01R3/00; G01R31/26
Foreign References:
| JP2006349692A | 2006-12-28 | |||
| US20020130676A1 | 2002-09-19 | |||
| KR101546363B1 | 2015-08-24 | |||
| KR20110008305A | 2011-01-26 | |||
| KR20110090298A | 2011-08-10 |
Attorney, Agent or Firm:
HONESTY & JR PARTNERS INTELLECTUAL PROPERTY LAW GROUP (KR)
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