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Title:
SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER, AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/078319
Kind Code:
A1
Abstract:
Provided is a semiconductor device that comprises: a rectangular semiconductor substrate (10) that has a surface on which a circuit element (11) is formed and a periphery (16); and a protective layer (20) that is disposed so as to cover the circuit element (11) and the aforementioned surface of the semiconductor substrate (10) and has an outer edge (21) that, at least, includes a region that follows the aforementioned periphery (16). In said region, the distance between the outer edge (21) and the periphery (16) varies along the periphery (16).

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Inventors:
MURAKAMI MAKOTO (JP)
Application Number:
PCT/JP2010/073320
Publication Date:
June 30, 2011
Filing Date:
December 24, 2010
Export Citation:
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Assignee:
FUJIKURA LTD (JP)
MURAKAMI MAKOTO (JP)
International Classes:
H01L21/301; H01L21/56; H01L23/28
Foreign References:
JP2005317839A2005-11-10
JP2837488B21998-12-16
JP2006318989A2006-11-24
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
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