Title:
SEMICONDUCTOR DEVICE, WIRING BOARD FOR MOUNTING SEMICONDUCTOR AND METHOD OF PRODUCTION OF SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/1996/042107
Kind Code:
A1
Abstract:
A semiconductor device structure for reliable semiconductor devices suffering less changes in their connection resistance in a long environmental test period, while reducing the manufacturing cost of the package including the chip. In the manufacture of a semiconductor device using a face-down semiconductor chip, metal bumps are formed on the substrate instead of those on the bonding pad of the chip, the entire chip surface is bonded with an organic, anisotropic conductive organic adhesive, and the entire or a part of the back face of the chip including at least the edges is covered with a sealing material.
Inventors:
KANEDA AIZOU (JP)
YASUDA MASAAKI (JP)
WATANABE ITSUO (JP)
OHTA TOMOHISA (JP)
INOUE FUMIO (JP)
TSUBOMATSU YOSHIAKI (JP)
YAMAZAKI TOSHIO (JP)
OHATA HIROHITO (JP)
TAKEMURA KENZO (JP)
NAGAI AKIRA (JP)
WATANABE OSAMU (JP)
SHIOZAWA NAOYUKI (JP)
KOJIMA KAZUYOSHI (JP)
TANAKA TOSHIAKI (JP)
YAMAMOTO KAZUNORI (JP)
YASUDA MASAAKI (JP)
WATANABE ITSUO (JP)
OHTA TOMOHISA (JP)
INOUE FUMIO (JP)
TSUBOMATSU YOSHIAKI (JP)
YAMAZAKI TOSHIO (JP)
OHATA HIROHITO (JP)
TAKEMURA KENZO (JP)
NAGAI AKIRA (JP)
WATANABE OSAMU (JP)
SHIOZAWA NAOYUKI (JP)
KOJIMA KAZUYOSHI (JP)
TANAKA TOSHIAKI (JP)
YAMAMOTO KAZUNORI (JP)
Application Number:
PCT/JP1996/001608
Publication Date:
December 27, 1996
Filing Date:
June 13, 1996
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
KANEDA AIZOU (JP)
YASUDA MASAAKI (JP)
WATANABE ITSUO (JP)
OHTA TOMOHISA (JP)
INOUE FUMIO (JP)
TSUBOMATSU YOSHIAKI (JP)
YAMAZAKI TOSHIO (JP)
OHATA HIROHITO (JP)
TAKEMURA KENZO (JP)
NAGAI AKIRA (JP)
WATANABE OSAMU (JP)
SHIOZAWA NAOYUKI (JP)
KOJIMA KAZUYOSHI (JP)
TANAKA TOSHIAKI (JP)
YAMAMOTO KAZUNORI (JP)
KANEDA AIZOU (JP)
YASUDA MASAAKI (JP)
WATANABE ITSUO (JP)
OHTA TOMOHISA (JP)
INOUE FUMIO (JP)
TSUBOMATSU YOSHIAKI (JP)
YAMAZAKI TOSHIO (JP)
OHATA HIROHITO (JP)
TAKEMURA KENZO (JP)
NAGAI AKIRA (JP)
WATANABE OSAMU (JP)
SHIOZAWA NAOYUKI (JP)
KOJIMA KAZUYOSHI (JP)
TANAKA TOSHIAKI (JP)
YAMAMOTO KAZUNORI (JP)
International Classes:
H01L21/60; H01L23/31; H01L23/498; H01L25/18; (IPC1-7): H01L21/60
Foreign References:
| JPS63160350A | 1988-07-04 | |||
| JPS5994441A | 1984-05-31 | |||
| JPH0513119A | 1993-01-22 | |||
| JPH06349973A | 1994-12-22 | |||
| JPS6237939U | 1987-03-06 | |||
| JPH07297560A | 1995-11-10 |
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