SEMICONDUCTOR DEVICE - NITTO DENKO CORP

Title:

SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/1995/006085

Kind Code:

A1

Abstract:

This invention relates to a semiconductor device sealed by using a thermosetting resin composition containing a thermosetting resin (I component), a curing agent (II component), and the following (III) and (IV) components. This semiconductor device is provided with heat resistance and flame retardance at the time of IR reflow, and has drastically improved reliability. (III) is a metal hydroxide expressed by the following general formula (1): n(MaOb).cH2O, where M is a metal element, a, b and c are positive numbers, n is a positive integer, M may be the same or different in repetition of MaOb, and a and b may be the same or different. (IV) is a metal oxide expressed by the following general formula (2): n'(QdOe), where Q is a metal element selected from the Groups IVa, Va, VIa, VIIa, VIIIa, Ib and IIb, d and e are positive numbers, n' is a positive integer, Q may be the same or different in repetition of QdOe, and d and e may be the same or different.

Inventors:

YAMAGUCHI MIHO (JP)
SHIRAI MITSUYOSHI (JP)
MORIKAWA YOSHITADA (JP)
MITSUOKA YOSHIAKI (JP)
KOUMOTO MICHIO (JP)

Application Number:

PCT/JP1994/001362

Publication Date:

March 02, 1995

Filing Date:

August 17, 1994

Export Citation:

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Assignee:

NITTO DENKO CORP (JP)
YAMAGUCHI MIHO (JP)
SHIRAI MITSUYOSHI (JP)
MORIKAWA YOSHITADA (JP)
MITSUOKA YOSHIAKI (JP)
KOUMOTO MICHIO (JP)

International Classes:

H01L23/29; (IPC1-7): C08K3/22; C08L63/00; C08L79/08; C08L101/00; H01L23/29

Foreign References:

JPH03157448A	1991-07-05
JPH0529495A	1993-02-05
JPH0525364A	1993-02-02
JPH02238053A	1990-09-20
JPH0297561A	1990-04-10

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