Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2008/069044
Kind Code:
A1
Abstract:
A semiconductor device has a reduced chip size and a reduced cost without being
limited by bump arrangement. The semiconductor device is provided with an interposer
substrate (3) which is mounted on a film substrate and composed of silicon, and
a semiconductor element (2) mounted on the interposer substrate (3) for driving
a liquid crystal. The interposer substrate (3) is provided with a plurality of
substrate protruding electrodes (5a, 5b, 5c) formed on the side of the semiconductor
element (2). The semiconductor element (2) is provided with a plurality of element
protruding electrodes (4a, 4b, 4c) which are bonded with the substrate protruding
electrodes (5a, 5b, 5c), respectively, and the element protruding electrodes
(4a, 4b, 4c) are arranged on the entire surface of the semiconductor element (2).
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Inventors:
NAKAGAWA TOMOKATSU
KATOH TATSUYA
KUDOSE SATORU
KATOH TATSUYA
KUDOSE SATORU
Application Number:
PCT/JP2007/072826
Publication Date:
June 12, 2008
Filing Date:
November 27, 2007
Export Citation:
Assignee:
SHARP KK (JP)
NAKAGAWA TOMOKATSU
KATOH TATSUYA
KUDOSE SATORU
NAKAGAWA TOMOKATSU
KATOH TATSUYA
KUDOSE SATORU
International Classes:
H01L23/12
Foreign References:
| JP2004207566A | 2004-07-22 | |||
| JPH11297751A | 1999-10-29 | |||
| JPH06168948A | 1994-06-14 | |||
| JPS6471140A | 1989-03-16 | |||
| JP2003303852A | 2003-10-24 | |||
| JPH11126792A | 1999-05-11 | |||
| JP2001142090A | 2001-05-25 | |||
| JPS6286744A | 1987-04-21 | |||
| JP2006013421A | 2006-01-12 | |||
| JPH09312317A | 1997-12-02 | |||
| JPH0513667A | 1993-01-22 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (2-6 Tenjinbashi 2-chome Kita,Kita-ku, Osaka-shi, Osaka 41, JP)
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