Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/106733
Kind Code:
A1
Abstract:
A semiconductor device with a design which prevents entry of cutting fluid and debris when dicing to form single pieces, and thereby improves reliability. The semiconductor device is provided with a substrate (6); at least one semiconductor chip (2) having a piezoelectric conversion function, mounted on a main surface of the substrate (6); a case (1) which is fixed to the main surface of the substrate (6) and covers the semiconductor chip; a through hole which is formed in either the substrate (6) or the case (1); and predetermined substance which is filled in the through hole and closes the through hole. The predetermined substance has a characteristic in which the substance becomes wet and spreads when heated and opens the through hole.
Inventors:
CHI DAHE
OIDA SEISHI
OIDA SEISHI
Application Number:
PCT/JP2010/001015
Publication Date:
September 23, 2010
Filing Date:
February 18, 2010
Export Citation:
Assignee:
PANASONIC CORP (JP)
CHI DAHE
OIDA SEISHI
CHI DAHE
OIDA SEISHI
International Classes:
H04R17/02; B81B3/00; B81C3/00; H04R1/02; H04R31/00
Domestic Patent References:
WO2005083764A1 | 2005-09-09 |
Foreign References:
JP2002016264A | 2002-01-18 | |||
JP2008271425A | 2008-11-06 | |||
JP2009028808A | 2009-02-12 |
Attorney, Agent or Firm:
NII, Hiromori (JP)
New house extensive 守 (JP)
New house extensive 守 (JP)
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