Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/002625
Kind Code:
A1
Abstract:
A semiconductor device (10) is provided with: at least one semiconductor chip (14a-14d); gate wiring (30a-30d) connected to at least the one semiconductor chip; first wiring (32a-32d) connected to at least the one semiconductor chip; and second wiring (34a-34d) connected to at least the one semiconductor chip. The first wiring and the second wiring extend along the gate wiring. The first wiring is disposed between the gate wiring and the second wiring. The first wiring is the wiring closest to the gate wiring. The length (d1) of a first portion (30x) of the gate wiring, said first portion facing the first wiring, is shorter than the length (d2) of a second portion (30y) of the gate wiring, said second portion facing the second wiring.
Inventors:
MICHIKOSHI HISATO (JP)
HIRAKATA NORIYUKI (JP)
NOTSU HIROSHI (JP)
HIRAKATA NORIYUKI (JP)
NOTSU HIROSHI (JP)
Application Number:
PCT/JP2013/063444
Publication Date:
January 03, 2014
Filing Date:
May 14, 2013
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01L21/60; H01L25/07; H01L23/48; H01L25/18
Domestic Patent References:
| WO2010004802A1 | 2010-01-14 |
Foreign References:
| JP2003110077A | 2003-04-11 | |||
| JP2004273749A | 2004-09-30 | |||
| JP2004342735A | 2004-12-02 | |||
| JP2004134460A | 2004-04-30 | |||
| JP4746061B2 | 2011-08-10 |
Other References:
See also references of EP 2869340A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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