Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/013848
Kind Code:
A1
Abstract:
This semiconductor device is provided with: a semiconductor element; a member having the semiconductor element mounted thereon by means of surface bonding; and a low elastic modulus material, which is disposed between the semiconductor element and the member for the purpose of bonding the semiconductor element to the member, and which has an elastic modulus lower than that of the semiconductor element and that of the member.
Inventors:
TAKARAGI SHINICHI (JP)
Application Number:
PCT/JP2013/067450
Publication Date:
January 23, 2014
Filing Date:
June 26, 2013
Export Citation:
Assignee:
NISSAN MOTOR (JP)
International Classes:
H01L21/52
Foreign References:
| JPH0344040A | 1991-02-25 | |||
| JPH11150135A | 1999-06-02 | |||
| JPS59201433A | 1984-11-15 | |||
| JPS59125835U | 1984-08-24 | |||
| JPS5844858U | 1983-03-25 | |||
| JPH0817995A | 1996-01-19 | |||
| JP2001127234A | 2001-05-11 | |||
| JPH11312764A | 1999-11-09 | |||
| JPS5067574A | 1975-06-06 | |||
| JPS57118658A | 1982-07-23 |
Attorney, Agent or Firm:
GOTO, Masaki et al. (JP)
Masaki Goto (JP)
Masaki Goto (JP)
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