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Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/027476
Kind Code:
A1
Abstract:
This semiconductor device includes: a substrate; a semiconductor element mounted on one surface of the substrate and having a functional region formed on an upper surface; a first translucent member layered on the functional region of the semiconductor element; and a sealing member, formed on one surface of the substrate, for covering the circumference of the semiconductor element and the circumference of the first translucent member and thereby sealing the first translucent member. The sealing member covers a region no greater than the lower half the thickness of the first translucent member.

Inventors:
AYANO KENJIRO (JP)
MASSAKI SHINICHI (JP)
INOUE SHUJI (JP)
Application Number:
PCT/JP2013/057260
Publication Date:
February 20, 2014
Filing Date:
March 14, 2013
Export Citation:
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Assignee:
AOI ELECTRONICS CO LTD (JP)
International Classes:
H01L27/14; H01L23/28; H04N5/369
Foreign References:
JPS62272774A1987-11-26
JP2006005029A2006-01-05
JP2003078121A2003-03-14
JP2002009265A2002-01-11
Attorney, Agent or Firm:
NAGAI, Fuyuki (JP)
Fuyuki Nagai (JP)
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