SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2014/041648

A1

This semiconductor device includes a gas-type acceleration sensor that includes, as constituent elements, a heater, a first temperature sensor, and a second temperature sensor. The semiconductor device further includes a first chip having the heater formed on a surface thereof, a second chip having the temperature sensors formed on a surface thereof, and a connection member that electrically connects the chips. The first chip and the second chip are stacked on each other with the connection member being interposed therebetween in such a manner that the surfaces are opposed to each other. In the stacking direction, the position of the heater is different from the positions of the temperature sensors. In the in-plane direction orthogonal to the stacking direction, the first temperature sensor and the second temperature sensor are arranged so as to be opposed to each other with the heater being interposed therebetween. The constituent members of the gas-type acceleration sensor formed on the upper capacitor chip, among the first chip and the second chip, are in direct contact with the connection member.

TANABE AKIRA (JP)
NAKASHIBA YASUTAKA (JP)

PCT/JP2012/073382

March 20, 2014

September 12, 2012

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RENESAS ELECTRONICS CORP (JP)
TANABE AKIRA (JP)
NAKASHIBA YASUTAKA (JP)

G01P15/02; G01P15/08; G01P15/18

JP2008039519A	2008-02-21
JP2005351892A	2005-12-22
JPH10332455A	1998-12-18
JP2001227902A	2001-08-24
JP2004037105A	2004-02-05
JPH08330476A	1996-12-13
JPH07260820A	1995-10-13

KUDOH Minoru (JP)
Minoru Kudo (JP)

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