Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/042055
Kind Code:
A1
Abstract:
[Problem] The purpose of the present invention is to provide a semiconductor device enabling an unprecedented reduction in the impact of thermal stress, in particular on a MEMS sensor. [Solution] The present invention is characterized by comprising: a MEMS sensor (3) composed principally of silicon layered onto a printed substrate (2) (support substrate) with a first die-bonding resin (5) interposed therebetween; a first silicon substrate (11) (magnetic sensor ASIC) layered onto the MEMS sensor (3) with a second die-bonding resin (9) interposed therebetween; and a molded resin (20) serving as a sealant; the die-bonding resins (5, 9) being formed of materials softer than the molded resin (20).
Inventors:
KIKUIRI KATSUYA (JP)
OKAWA HISANOBU (JP)
OKAWA HISANOBU (JP)
Application Number:
PCT/JP2013/073814
Publication Date:
March 20, 2014
Filing Date:
September 04, 2013
Export Citation:
Assignee:
ALPS ELECTRIC CO LTD (JP)
International Classes:
B81B7/02; G01P15/08; G01P15/18; H01L21/52
Domestic Patent References:
WO2012124282A1 | 2012-09-20 | |||
WO2007020701A1 | 2007-02-22 |
Foreign References:
JP2000214177A | 2000-08-04 | |||
JP2009063550A | 2009-03-26 | |||
JP2010073765A | 2010-04-02 | |||
JP2004132792A | 2004-04-30 |
Attorney, Agent or Firm:
NOZAKI, Teruo (JP)
Teruo Nozaki (JP)
Teruo Nozaki (JP)
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