Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/069353
Kind Code:
A1
Abstract:
Provided is a highly reliable semiconductor device which exhibits excellent heat dissipation performance of a heat-generating element and solves the problem of decrease in the bonding strength between the heat-generating element and a substrate due to the stress caused by the thermal expansion difference between the heat-generating element and the substrate, said problem occurring when a film having a high heat conductivity is cooled after thermal curing and in the thermal history after assembling, and the problem of insufficient heat resistance of the film.
A semiconductor device (1) which is provided with a heat-generating element (2), a heat-receiving device (3), and a highly heat conductive layer (4) that is arranged between the heat-generating element (2) and the heat-receiving device (3) in order to transfer heat from the heat-generating element (2) to the heat-receiving device (3). This semiconductor device (1) is characterized in that: the highly heat conductive layer (4) is a thermally cured product of a highly heat conductive film that contains (A) two or more kinds of thermosetting resins which contain a polyether compound having phenyl groups, to each of which at least a vinyl group having a specific structure is bonded, at both ends, (B) a thermoplastic elastomer, (C) a heat conductive inorganic filler and (D) a curing agent; and the highly heat conductive layer (4) has a thickness of 10-300 μm.
Inventors:
TAKASUGI HIROSHI (JP)
TERAKI SHIN (JP)
TOSHIMA JUN (JP)
TERAKI SHIN (JP)
TOSHIMA JUN (JP)
Application Number:
PCT/JP2013/078927
Publication Date:
May 08, 2014
Filing Date:
October 25, 2013
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
H01L23/373; C08K3/00; C08L21/00; C08L71/12; C09J11/04; C09J171/10; C09J201/00; H01L21/52; H01L23/12
Domestic Patent References:
| WO2008018483A1 | 2008-02-14 |
Foreign References:
| JP2004059644A | 2004-02-26 | |||
| JP2002069392A | 2002-03-08 |
Attorney, Agent or Firm:
WATARAI YUSUKE (JP)
Yuusuke Watarai (JP)
Yuusuke Watarai (JP)
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