Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/151235
Kind Code:
A1
Abstract:
This semiconductor device is provided with: an insulating substrate having an insulating board configured from a ceramic, and a circuit board on a main surface of the insulating board; a semiconductor element fixed on the circuit board; a printed board that is provided to face the main surface of the insulating board; a ceramic board, which faces the main surface of the insulating board, and which is provided further from the main surface of the insulating board than the printed board; a supporting member, which is fixed on the main surface of the insulating board or on the circuit board, and which fixes the position of the ceramic board; and a resin with which the circuit board, the semiconductor element, the printed board, and the ceramic board are covered.
Inventors:
NAKAMURA HIDEYO (JP)
Application Number:
PCT/JP2014/059679
Publication Date:
October 08, 2015
Filing Date:
April 01, 2014
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01L23/28; H01L25/07; H01L25/18
Domestic Patent References:
| WO2013118415A1 | 2013-08-15 |
Foreign References:
| JP2007311441A | 2007-11-29 | |||
| JPH0778921A | 1995-03-20 | |||
| JPH06140548A | 1994-05-20 | |||
| JP2003243598A | 2003-08-29 |
Other References:
See also references of EP 3043379A4
Attorney, Agent or Firm:
HONDA ICHIRO (JP)
Ichiro Honda (JP)
Ichiro Honda (JP)
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