Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/002368
Kind Code:
A1
Abstract:
A chip-size package-type semiconductor device (1) is provided with a plurality of electrodes connected to two kinds of potentials at most. In discretionary combinations of a first electrode (51) connected to a first potential, and a second electrode (52) connected to a second potential, said first electrode and said second electrode being among the electrodes, the closest points of respective first electrode (51) and second electrode (52) are on a straight line (44) diagonal to a chip side. The first electrode (51) and the second electrode (52) may be provided within a strip-shaped region (45) having a width equal to or less than a predetermined value w in plan view.
Inventors:
OTA TOMONARI
SOTA SHIGETOSHI
YASUDA EIJI
IMAMURA TAKESHI
IMAI TOSHIKAZU
OKAWA RYOSUKE
YOSHIDA KAZUMA
HIRAKO MASAAKI
AHN DANNY
SOTA SHIGETOSHI
YASUDA EIJI
IMAMURA TAKESHI
IMAI TOSHIKAZU
OKAWA RYOSUKE
YOSHIDA KAZUMA
HIRAKO MASAAKI
AHN DANNY
Application Number:
PCT/JP2016/003133
Publication Date:
January 05, 2017
Filing Date:
June 30, 2016
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L21/822; H01L21/8234; H01L27/04; H01L27/088; H01L29/78
Foreign References:
| JP2009530826A | 2009-08-27 | |||
| JP2007194305A | 2007-08-02 | |||
| JP2008053623A | 2008-03-06 | |||
| JP2004502293A | 2004-01-22 | |||
| JP2013247309A | 2013-12-09 |
Attorney, Agent or Firm:
KAMATA, Kenji et al. (JP)
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