Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/002528
Kind Code:
A1
Abstract:
The purpose of the present invention is to secure a sensor chip while preventing breakage of the sensor chip. As a result, for the purpose of providing a semiconductor device with improved yield, the present invention is a semiconductor device comprising a sensor chip, a first resin that covers the inner peripheral section of the sensor chip, and a second resin that covers the outer peripheral section of the sensor chip. The semiconductor device is characterized in that: the sensor chip comprises a sensing section; the sensing section is on the inner peripheral section of the sensor chip; the first resin covers a first surface of the sensor chip that corresponds to the sensing section; and the second resin covers a second surface of the sensor chip that does not correspond to the sensing section.
Inventors:
DEGAWA MUNENORI (JP)
KIKUCHI HIROSHI (JP)
HAYASHI MASAHIDE (JP)
KIKUCHI HIROSHI (JP)
HAYASHI MASAHIDE (JP)
Application Number:
PCT/JP2016/066528
Publication Date:
January 05, 2017
Filing Date:
June 03, 2016
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
G01P15/08; B81B7/02; G01C19/5769; G01P15/125; H01L23/28; H01L23/29; H01L23/31; H01L29/84
Foreign References:
| JP2015007559A | 2015-01-15 | |||
| JPH09119875A | 1997-05-06 | |||
| JPH0883869A | 1996-03-26 | |||
| JP2015018922A | 2015-01-29 |
Attorney, Agent or Firm:
INOUE Manabu et al. (JP)
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