Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/013768
Kind Code:
A1
Abstract:
The present invention is provided with a first semiconductor chip, a second semiconductor chip disposed so as to be electrically isolated from the first semiconductor chip, and a transmission transformer that is a chip transformer in which a conductor layer and an insulation layer are laminated, the transmission-side terminal of the transmission transformer connecting to the first semiconductor chip and the receiving-side terminal of the transmission transformer connecting to the second semiconductor chip. A control signal for controlling the operation of the second semiconductor chip is transmitted from the first semiconductor chip to the second semiconductor chip via the transmission transformer.
Inventors:
TAJIMA KAZUNAO (JP)
PARK HYO-JEONG (JP)
PARK HYO-JEONG (JP)
Application Number:
PCT/JP2015/070834
Publication Date:
January 26, 2017
Filing Date:
July 22, 2015
Export Citation:
Assignee:
SANKEN ELECTRIC CO LTD (JP)
International Classes:
H01F17/00; H04L25/02; H01L25/00; H04B5/02
Domestic Patent References:
| WO2013027454A1 | 2013-02-28 |
Foreign References:
| JP2013229812A | 2013-11-07 | |||
| JPH04133408A | 1992-05-07 | |||
| JPH0766361A | 1995-03-10 |
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
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