Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/081823
Kind Code:
A1
Abstract:
A semiconductor device (100) is provided with: a semiconductor integrated circuit (2) having a bump mounting surface (2S); and a thin film capacitor unit (1) connected to the bump mounting surface by means of bumps (22). The semiconductor integrated circuit (2) includes: a first power supply pad (21V), to which a power supply voltage (Vdd) of one polarity is applied; and a second power supply pad (21G), to which a power supply voltage (Gnd) of the other polarity is applied. The thin film capacitor unit (1) includes: a first electrode layer (11) connected to the first power supply pad; a second electrode layer (12) connected to the second power supply pad; and a dielectric layer (13) formed between the first electrode layer and the second electrode layer. The semiconductor device is provided with: a power supply path (30) for supplying power to the semiconductor integrated circuit; and a thin-plate-like metal resistor unit (17), which is provided in the power supply path, and is formed of a metallic high-resistance material having a volume resistivity that is higher than that of the first electrode layer and that of the second electrode layer.
Inventors:
OYAMADA SEISEI (JP)
Application Number:
PCT/JP2015/082028
Publication Date:
May 18, 2017
Filing Date:
November 13, 2015
Export Citation:
Assignee:
NODA SCREEN CO LTD (JP)
International Classes:
H01L21/822; H01L27/04
Foreign References:
| JP2007234843A | 2007-09-13 | |||
| JP2001015654A | 2001-01-19 | |||
| JP2010283130A | 2010-12-16 | |||
| JP2007080946A | 2007-03-29 | |||
| JP2008270369A | 2008-11-06 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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