Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/138072
Kind Code:
A1
Abstract:
Provided is a semiconductor device wherein a die pad shift of a lead frame can be more reliably suppressed. Specifically, a lead frame (2) included in the semiconductor device includes a die pad (2a), first and second suspension leads (4a, 4b), and a frame (2b). The main surface of the die pad (2a) and the main surface of the frame (2b) are positioned on planes different from each other, and the die pad (2a) and the frame (2b) are connected to each other by means of the first and second suspension leads (4a, 4b). A first boundary line (5b) between the first suspension lead (4b) and the die pad (2a) extends on a straight line different from a second boundary line (5a) between the second suspension lead (4a) and the die pad (2a). A third boundary line (6b) between the first suspension lead (4b) and the frame (2b) extends on a straight line different from a fourth boundary line (6a) between the second suspension lead (4a) and the frame (2b).
Inventors:
IWAI TAKAMASA (JP)
KONDO SATOSHI (JP)
KAWASHIMA HIROSHI (JP)
FUJINO JUNJI (JP)
SAKAMOTO KEN (JP)
KONDO SATOSHI (JP)
KAWASHIMA HIROSHI (JP)
FUJINO JUNJI (JP)
SAKAMOTO KEN (JP)
Application Number:
PCT/JP2016/053671
Publication Date:
August 17, 2017
Filing Date:
February 08, 2016
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/50
Foreign References:
| US6075283A | 2000-06-13 | |||
| US20100193920A1 | 2010-08-05 | |||
| JP2000150553A | 2000-05-30 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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