Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/179448
Kind Code:
A1
Abstract:
A semiconductor device 1 has a substrate 2 covered with a sealing resin 70, and an electronic circuit 4 and a resist 3, which are formed on the substrate. The substrate 2 has: a forming section 30, on which the resist 3 is formed; a non-forming section 31 in contact with the sealing resin without having the resist 3 formed thereon; and a recessed section 5, the inside of which is filled with the resist 3 or the sealing resin 70, and to which stress received from the sealing resin is concentrated.
Inventors:
YAMAGUCHI HIDEYA (JP)
SHICHITA KENTO (JP)
SHICHITA KENTO (JP)
Application Number:
PCT/JP2017/013652
Publication Date:
October 19, 2017
Filing Date:
March 31, 2017
Export Citation:
Assignee:
TOKAI RIKA CO LTD (JP)
International Classes:
H01L23/29; H01L23/12; H01L23/31
Foreign References:
| JP2013187740A | 2013-09-19 | |||
| JP2000040774A | 2000-02-08 | |||
| JP2000124344A | 2000-04-28 | |||
| JPS58144855U | 1983-09-29 |
Attorney, Agent or Firm:
HIRATA, Tadao (JP)
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